Press Release



Moratelindo Succeds in Holding AGMS, EGMS and Annual Public Expose 2023
Issuance & Offering of Shelf Registration Sukuk Ijarah II Moratelindo Phase I Year 2023 of PT Mora Telematika Indonesia Tbk
Extraordinary General Meeting Of Shareholders (EGMS) of Pt Mora Telematika Indonesia Tbk Regarding The Changes In The Composition of Members of The Board of Directors
The Signing of The Memorandum of Understanding (MoU) Between PT Mora Telematika Indonesia Tbk And Mitsui & Co., Ltd. Concerning The Establishment of Joint Venture Company For The Development of The Passive Telecommunication Infrastructure In Indonesia
Clarification of Moratelindo Never Participated in the Project for Provision of 4G Base Transceiver Station (BTS) Infrastructure and Supporting Infrastructure Packages 1,2,3,4 and 5
Initial Listing of Moratelindo Shares on the Indonesia Stock Exchange
Initial Public Offering ("IPO") of PT Mora Telematika Indonesia
The Signing of Memorandum of Understanding Between Moratelindo and Bekasi City Government for Smart City Development
Issuance & Offering of Moratelindo Phase IV Year 2021 Shelf Offering Sukuk Ijarah
Redemption of the Principal of Moratelindo's Bonds I 2017 Series A
Issuance & Offering of Moratelindo Phase III Year 2020 Shelf Offering Sukuk Ijarah
Moratelindo Starts Project for Fiber Optic Cable Channels and Cellular Telecommunication Towers in Semarang
Issuance & Offering of Moratelindo Phase II Year 2020 Shelf Offering Sukuk Ijarah
Moratelindo Regains Trust of the Local Government in Public Service Project for the Construction of Fiber Optic Cable line and Microcell Pole Tower
President of the Republic of Indonesia Joko Widodo Inaugurates the National Strategic Infrastructure Priority Project for East Palapa Ring Package
Issuance & Offering of Moratelindo Phase I Year 2019 Shelf Offering Sukuk Ijarah
Care for the Environment, Moratelindo Plant Mangrove Seedlings
PT Mora Telematika Indonesia Successfully Completed Listing Moratelindo Bonds I Year 2017 in IDX
Moratelindo Issued Rp 1 Trillion Bond I with A (id) Rating from Indonesian Rating Agency